Hebenstreit, Wafer Production Line, New, 50 Sheets per Minute, Batter and Cream Mixing Plants (New)

Overview

1. Hebenstreit supplies fully automatic plants for the manufacture of flat and hollow wafers.

2. The product range covers automatic wafer baking machines for the manufacture of wafer sheets, all types of further-processing machines, and automatic feeder facilities for downstream packaging machines or chocolate coating plants.

3. The product range also includes semi-automatic and fully automatic plants for the manufacture of wafer batter and cream fillings.

4. Key strength is expertise in customised solutions for the realisation of innovative product ideas.

5. Founded in 1898 in Radebeul near Dresden, based in Frankfurt am Main since 1950, and in Moerfelden-Walldorf since 1978.

6. Ancillary plant in Radebeul near Dresden.

7. Headquarters and parent works in Moerfelden-Walldorf near Frankfurt am Main.

8. In 1997, the original company in Radebeul returned to the Hebenstreit Group where part of the product range and several machine components are manufactured on ultramodern machining centres.

9. Customers benefit from the support of a worldwide network of representatives.

Wafer Types and Design

1. Flat wafers are manufactured with fine, medium or deep reeding in all manner of shapes and sizes, as well as with company logo or special engraving if required.

2. Flat wafers are filled with one or more layers of cream, caramel, chocolate or jam.

3. Flat wafers are also produced as coated wafer bars in a huge range of shapes and sizes, in some cases sprinkled with nuts and then coated with chocolate.

4. Hollow wafers are made up of two wafer halves that are filled and joined.

5. Hollow wafers offer a multitude of shapes and sizes, with additional variations such as inserting whole hazelnuts, adding a chocolate coating and decorating, or coating with a sprinkling of nuts.

Automatic Wafer Baking Machines

1. Automatic wafer baking machine BAC: available with 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140 or 150 baking tongs (as well as all sizes in between), designed for a capacity of up to 65 wafer sheets per minute.

2. Baking plate size up to 500 x 350 mm or 700 x 350 mm for BAC.

3. Automatic wafer baking machine WAQ: further developed, fully automatic machine generation for plants of small and medium capacity, can be fitted with 28, 36, 44, 52, 60 or more baking tongs, for a capacity of up to 40 wafer sheets per minute.

4. Heating and separation of the heating chamber: machines are heated using natural gas or propane/butane, burners arranged in the centre of the baking machine are separated from the outer area by additional bulkheads, heat is concentrated on the baking plates while hinge, locking and carrier rollers are located in the outer and cooler area beyond the bulkhead, resulting in longer maintenance intervals and longer service life of the bearings.

5. Baking tongs: extremely robust baking tong chain with virtually wear-resistant locking system, steam pressure produced during the baking process results in many millions of load alternations borne by a solid baking tong frame, even after many years of use the baking plates are quite easy to adjust with a wafer thickness tolerance of just +/- 0.1 mm across the whole surface.

6. Baking tong locking system: no-play opening and closing, fixed locking rollers are used to close the baking tongs by pressing the upper and lower tong components together and they are then locked by means of a locking hook, carrier rollers are completely load-free during closing and are for transport purposes only, bearing play has no effect on the locking mechanism and the wafer sheet thickness.

Wafer Sheet Coolers and Conditioners

1. Wafer sheet cooler EPH.

2. Wafer sheet conditioner CK.

Wafer Spreading Machines

1. Wafer spreading machines WZ, WZK.

2. Hollow wafer spreading machine WZH.

3. Pressing device WEA.

4. Check weigher KW.

5. Nut depositing device NE.

6. Hollow wafer doubling device ZLV.

7. Sprinkling device SV.

Wafer Sandwich Coolers

1. Wafer sandwich cooling tower KT.

2. Spiral wafer sandwich cooler KSP.

Wafer Cutting Machines and Ancillary Equipment

1. Wafer cutting machine WD.

2. Wafer sandwich storage unit ERM.

3. Wafer discharge device WEP.

4. Wafer distribution device EG.

5. Magazine cutter EGS.

6. Round wafer cutting machine WJR.

7. Wafer punching press WJH.

8. Cutting and infeed device.

Batter and Cream Production Plants

1. Wafer batter production plant TMA.

2. Cream production plant CMA.

Wafer Production Plants Type Compact

1. Wafer production plants type compact.

Plant Examples

1. Flat wafer plants.

2. Hollow wafer plants.