Model TEP 175-70 transfer molding press designed for low pressure encapsulation of electronic parts using low-viscosity thermosetting resins.
The vertical ram-type mold clamping unit housed in the console cabinet and the top transfer unit are driven hydraulically and can be operated either in manual or semi-automatic mode through magnetic control.
Specifications
Tonage: 175-7
Stroke: 300 - 115
Daylight: 750
Clamp maximum: 175 (190 nt)
Transfer maximum: 5 (5.5 nt)
Clamp stroke: 300 mm
Transfer stroke: 300 mm
Ejector stroke: 0 ~ 75 mm
Clamp system working pressure max.: 190 kg/cm (2690 psi)
Transfer system working pressure max.: 100 kg/cm (1430 psi)
Dimensions
Die space: 820 x 880 mm
Daylight: 750 mm
Overall height: 2940 mm
Height up to moving platen: 1000 mm
Floor space: 2600 x 2300 mm
Ejector spacing: 495, 600 mm
Ejector rod diameter: 5/8 inch
Plunger thread: 1-1/8 inch, 12 unf, 60 deep
Speeds (60 Hz)
Clamp fast: 170 mm/sec
Clamp slow: 9 mm/sec
Clamp return: 180 mm/sec
Transfer slow: 0 ~ 21 mm/sec (two cylinder)
Transfer return: 150 mm/sec (two cylinder)
Electrical and Utility Requirements
Motor power (480v, 60 hz): 3.7 kw - 6p, 7.5 kw - 6p
Electric heater (230v): 24 kw
Cooling water: 30 l/min
Water connection: 1" pt, 3/4" pt
Oil tank capacity: 340 l
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