Description Application Fields Measurement of plating thickness, element composition of plating and solutions. Features 0.1 micro collimator High-accuracy movable platform can precisely locate the test point with repeated accuracy less than 0.01 μm Heights positioning laser can auto locate the height Positioning laser can precisely locate the facula to ensure the test point aligns to it The mouse can control the movable platform; the mouse clicking position is the test point High resolution detector can improve the analysis accuracy Excellent ray shielding The test interface is protected by high sensitivity sensor
